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Intel and Micron 3D XPoint memory is 1,000 faster and 1,000 more durable than NAND

Posted on Tuesday, July 28 2015 @ 20:03:16 CEST by


Intel logo
Intel and Micron jointly announced the development of 3D XPoint, a new type of non-volatile memory that promises to combine the best features of NAND and DRAM. The firms claim 3D XPoint is up to 1,000 times faster than current NAND flash memory, this will allow 3D XPpoint to be used for both storage (like NAND) and main memory (like DRAM). Not only is it much faster than NAND but 3D XPoint also promises 1,000 times greater endurance than NAND, as well as ten times higher storage density than conventional memory!

3D XPoint will start sampling this year with select customers and both Intel and Micron are developing end-user products based on the technology. Initial 3D XPoint memory will have a storage capacity of 128Gb (16GB) per die but chip capacity can be raised much higher thanks to 3D stacking.

The firms claim this is the first major new memory technology since the introduction of NAND in 1989. Pronounced as 3D Cross-Point, Intel and Micron explain this memory uses a crosspoint structure as well as breakthrough material advances.

While memory like NAND stores data by trapping electrons, 3D XPoint is fundamentally different as it stores data by changing the property of the storage cells: it uses a binary change in the resistance of the entire cell material. Intel and Micron didn't call it by name but it sounds a lot like this is resistive random-access memory (RRAM) and this is indeed very promising.
Intel Corporation and Micron Technology, Inc. today unveiled 3D XPoint™ technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989. The explosion of connected devices and digital services is generating massive amounts of new data. To make this data useful, it must be stored and analyzed very quickly, creating challenges for service providers and system builders who must balance cost, power and performance trade-offs when they design memory and storage solutions. 3D XPoint technology combines the performance, density, power, non-volatility and cost advantages of all available memory technologies on the market today. The technology is up to 1,000 times faster and has up to 1,000 times greater endurance than NAND, and is 10 times denser than conventional memory.

"For decades, the industry has searched for ways to reduce the lag time between the processor and data to allow much faster analysis," said Rob Crooke, senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. "This new class of non-volatile memory achieves this goal and brings game-changing performance to memory and storage solutions."

"One of the most significant hurdles in modern computing is the time it takes the processor to reach data on long-term storage," said Mark Adams, president of Micron. "This new class of non-volatile memory is a revolutionary technology that allows for quick access to enormous data sets and enables entirely new applications."

As the digital world quickly grows – from 4.4 zettabytes of digital data created in 2013 to an expected 44 zettabytes by 20204 – 3D XPoint technology can turn this immense amount of data into valuable information in nanoseconds. For example, retailers may use 3D XPoint technology to more quickly identify fraud detection patterns in financial transactions; healthcare researchers could process and analyze larger data sets in real time, accelerating complex tasks such as genetic analysis and disease tracking.

The performance benefits of 3D XPoint technology could also enhance the PC experience, allowing consumers to enjoy faster interactive social media and collaboration as well as more immersive gaming experiences. The non-volatile nature of the technology also makes it a great choice for a variety of low-latency storage applications since data is not erased when the device is powered off.

New Recipe, Architecture for Breakthrough Memory Technology
Following more than a decade of research and development, 3D XPoint technology was built from the ground up to address the need for non-volatile, high-performance, high-endurance and high-capacity storage and memory at an affordable cost. It ushers in a new class of non-volatile memory that significantly reduces latencies, allowing much more data to be stored close to the processor and accessed at speeds previously impossible for non-volatile storage.

The innovative, transistor-less cross point architecture creates a three-dimensional checkerboard where memory cells sit at the intersection of word lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to faster and more efficient read/write processes.
Intel Micron 3D XPoint



 



 

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