The site discovered that the substrate Intel is using on the i7-6700K is only 0.8mm thick, compared to 1.1mm on the Core i7-4770K. This difference in height is compensated by a thicker integrated heatspreader (IHC) so you can reuse old HSFs without a problem.
The chip giant is using a rather viscous silver-based TIM between the die and the IHS but unfortunately its performance seems to be rather poor.
PC Watch swapped out the stock TIM with Prolimatech PK-3 and Cool Laboratory Liquid Pro and observed temperature differences of up to 16°C (stock clockspeed) and 20°C (overclocked) under heavy load.
Via: TPU