Posted on Friday, June 17 2016 @ 12:35 CEST by Thomas De Maesschalck
DigiTimes
reports TSMC acquired land use rights for a 449,500 square meter industrial site in the Nanjing Pukou Economic Development Zone, China. The land will be used to construct the Taiwanese foundry's first 300mm wafer fab in China. The term of the land-use rights is 50 years.
TSMC and the municipal government of Nanjing, China in March 2016 signed an agreement under which the foundry house will make an investment in Chinese city valued at US$3 billion to establish TSMC (Nanjing) Co., a wholly-owned subsidiary managing a 12-inch wafer fab and a design service center.
Groundbreaking is expected to start in July and if all goes well, the fab will start churning out 16nm chips in the second half of 2018, with a wafer start capacity of 20,000 a month.
