Posted on Monday, June 20 2016 @ 13:51 CEST by Thomas De Maesschalck
Korea Times
reports Samsung is rolling out its own Fan-Out Wafer Level Package (FoWLP) chip packing technology. This new technique does not require printed circuit boards (PCBs), it allows phone makers to create thinner smartphones and it also promises greater energy efficiency. The technology may help Samsung to gain Apple SoC orders, depending on how competitive it is versus TSMC.
"TSMC was earlier named the sole supplier for the iPhone 7's processor. It is hard to say for sure at the moment, but expectations are that the FoWLP technology would allow Samsung to win chip orders from Apple for the iPhone 7S."
TSMC is known to hold a 50 to 60 percent yield rate to produce chips using its own FoWLP technology, according to the analyst.
"The point lies in how much Samsung can raise the rate to forge its own competitiveness and attract Apple," he said.
This is the first time that Samsung Electro has tapped into the chip-packing business. The company remained cautious over announcing the latest feat.
A company official said, "We cannot unveil details over when Samsung is going to mass-produce chips with the technology."
