Speaking at a pre-show press conference at Semicon Taiwan, TSMC business development executive Simon Wang said the foundry has high hopes for its 7nm process. Wang reiterated that TSMC expects to move to volume production in Q1 2018 and said he's confident that TSMC's 7nm process will beat competitors in terms of area, performance and power.
First revenue from 10nm products is expected to be recorded in Q1 2017, from earlier statements we know TSMC taped out at least three client products on its 10nm process. Wang also talked about EUV and said TSMC plans to implement it on the 5nm node, with risk production in the first half of 2019.
Moving forward, TSMC expects to ramp up production of 7nm chips in the first quarter of 2018, Wang said. TSMC is confident the PPA (power, performance and area) on its 7nm process technology will outperform rivals', Wang added.
In addition, TSMC has been engaged in R&D for 5nm process technology, and will be ready to use extreme ultraviolet (EUV) lithography to make 5nm chips, Wang said. Risk production is expected to complete in the first half of 2019, Wang indicated.