Earlier this week details were revealed about Samsung's foundry technology roadmap. The South Korean company revealed it is on track to put extreme ultraviolet (EUV) lithography into production next year at the 7nm node. Samsung also said it intends to shrink FinFET process technology down to 5nm and that it aims to get a 4nm "post FinFET" process in risk production in 2020.
EUV, a long-promised an often pushed out lithography technology to succeed 193nm immersion lithography, finally appears to be on the verge of being inserted into production. Taiwan Semiconductor Manufacturing Co. (TSMC) and Globalfoundries, Samsung’s chief foundry competitors, have both declared their intentions to use EUV in production in 2019.
Samsung has demonstrated the EUV power source production target of 250W in process development. According to Low, the “magic number” for productivity with EUV is 1,500 wafers per day. Samsung has already exceeded 1,000 wafers per day and has a high degree of confidence that 1,500 wafers per day is achievable, Low said.
Samsung's 8nm LPP process will be offered this year, 7nm LPP with EUV next year, and 5nm and 6nm LPP processes are scheduled for 2019. Additionally, Samsung also has 18nm FD-SOI lined up for risk production in 2019.