This new model will feature a better VRM heatsink design, a backplate behind the VRM area to further increase heat dissipation and mounting points for an additional fan:
The new design, which has added engineering hours behind it compared to the original solution, sports threaded fins to increase airflow through the VRM cooling block. Previously, this block was just that - a solid one - which didn't facilitate or take advantage of any airflow your case might offer. In addition, ASUS has also added mounting points for a small, dedicated fan for an increased cooling capacity. Also worth mentioning is the addition of a backplate behind the VRM area of the motherboard, so as to further increase heat dissipation.
Via: TPU