The first extreme ultraviolet (EUV) based process that will be offered by TSMC will be known as N7+. TSMC said it will be relatively simple to port design rules and IP to the N7+ process and claims it can put this in production in 2019:
The foundry will provide a utility to port immersion design rules to the EUV process that will “clean up most of the layout differences,” Hou said. Overall, the work of moving from N7 to N7+ should represent about a third of the effort of migrating to a new node, he added.The first EUV-based 7nm node promises 20 percent greater density, 8-10 percent higher speeds and 15-20 percent lower power consumption than the traditional 7nm node.
Compared with the 16FFC process, an ARM A72 core made on the the N7+ node can be optimized for 30 percent higher performance or 50 percent lower power consumption. Further details about TSMC's new silicon menu can be read at EE Times.