At a recent event in Shanghai, GlobalFoundries CTO Gary Patton revealed that the foundry's extreme ultraviolet (EUV) mask yield rate is now close to hitting 65 percent. Foundries like TSMC, GlobalFoundries and Samsung are gearing up to adopt EUV as quickly as possible, but there's still a lot of work to be done to implement the new lithography technique.
GlobalFoundries says its target for volume production is a EUV mask yield rate of 95 percent. The foundry will start using EUV on its 7nm FinFET node, and it's cooperating with AMD in the process development.
Earlier in 2017, Globalfoundries introduced its 7nm leading-performance (7LP) FinFET semiconductor technology which the company claimed will deliver greater than 40% more processing power and twice the area scaling than the previous 14nm FinFET technology. The company also disclosed it is investing in new process equipment capabilities, including the addition of the first two EUV lithography tools in the second half of 2017, to accelerate the 7LP production ramp. The initial production ramp of 7LP will be based on an optical lithography approach, with migration to EUV lithography when the technology is ready for volume manufacturing.
More details at DigiTimes, they also have some snippets about GlobalFoundries' 22nm FD-SOI technology.