HardOCP's Kyle Bennett picked up some interesting rumors about Intel's high-end desktop (HEDT) platform. First up, the site writes Intel's Kaby Lake-X will hit end-of-life (EOL) phase later this year. This platform will not receive a replacement, which isn't a surprise as Kaby Lake-X hardly made any sense.
Skylake-X on the other hand will reportedly get a refresh in late Q3 2018 or early Q4 2018. These parts were launched in June 2017 and it seems there won't be much new with the refresh. The lineup will still go from six to eighteen cores, but one major difference is that Intel is reportedly switching from PTIM (Polymer Thermal Interface Material) to STIM (Solder Thermal Interface Material). A lot of enthusiasts will be very glad if this is true!
The switch to solder will reportedly enable Intel to clock the new parts 150-200MHz higher on the base and Turbo frequencies. Kyle also claims that binned parts could hit ~5GHz on 12 and 14 core parts!
Intel is looking to target bins pushing ~5GHz on 12 and 14 core parts (WOW!) with an estimated TDP range of 275w to 300w on Socket R. This TDP bump will assuredly will require new VRM layouts on motherboards, so we will see some new boards out to address these CPUs specifically and it looks that SuperMicro is at the front of the pack on that. SuperMicro tipped its hand to this at CES showing off 300W TDP support.
Cascade Lake-X on the other hand may be delayed from late 2018 to mid to late Q2 2019. This is another 14nm part, it's the successor of Skylake-X. It will likely also feature a soldered IHS.