Intel Core i9-9900K may get a soldered IHS, launch on August 1?

Posted on Wednesday, Jul 25 2018 @ 11:39 CEST by Thomas De Maesschalck
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TechPowerUp heard whispers that Intel's upcoming Core i9-9900K flagship may have a soldered IHS. The thermal paste used under the heatspreader of Intel's current desktop chips has resulted in a lot of criticism, as this thermal solution results in higher temperatures than soldered heatspreaders. No official word yet, but we can be hopeful that the Core i9 "Whiskey Lake" eight-core CPU will change things for the better.

Interestingly, the chip may be released as early as one week from now. Be prepared to pay a pretty penny though:
The first Core i9 "Whiskey Lake" SKU is the i9-9900K, an 8-core/16-thread chip clocked between 3.60~5.00 GHz, armed with 16 MB of L3 cache. The introduction of the Core i9 extension to the mainstream desktop segment could mean Intel is carving out a new price point for this platform that could be above the $300-350 price traditionally held by top Core i7 "K" SKUs from the previous generations. In related news, we are also hearing that the i9-9900K could be launched as early as 1st August, 2018.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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