Intel teases Lakefield architecture with Foveros 3D packaging (video)

Intel uploaded a new video that shows off the new Lakefield architecture, a hybrid CPU that uses Foveros 3D packaging to tie different pieces of IP together into a single product. With this new packaging technology, Intel will be able to make smaller computing solutions, which will result in a smaller motherboard footprint.

The Lakefield package features a Sunny Cove CPU core, four smaller CPU cores, 1.5MB L2 cache, 4MB Last Level Cache (LLC), Intel Graphics Gen 11 Low Power with 64 EUs, LP-DDR4 memory, and some more components. The SoC measures just 12mm x 12mm and is expected to ship by the end of this year.