Intel reveals more about its interconnected future

Posted on Thursday, Apr 18 2019 @ 10:29 CEST by Thomas De Maesschalck
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AnandTech had a call with Intel and received new details and fresh insight into the chip giant's interconnected future, which involves the combining of chiplets, the EMIB technology, and Foveros. It's too much too condense so you can read the full piece over here.
The other element to our discussion was a reaffirmation of comments made previously by Dr. Murthy Renduchintala, Intel’s Chief Engineering Officer and Group President of the Technology, Systems, Architecture and Client Group. Ramune stated that chiplet technology and packaging technologies are designed to run asynchronously to Intel’s current manufacturing processes. Ultimately the goal here is to apply the technologies to the process currently available, rather than fixing development and tying development to a single node strategy. As we’ve seen with how Intel’s 10nm development has progressed, this disaggregation of product and technology is going to be an important step in Intel’s future.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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