As previously reported, TSMC’s N6 process technologies adopts extreme ultraviolet lithography (EUVL) to lower manufacturing complexity by reducing the number of exposures required for multi-patterning (which is needed today as TSMC’s N7 uses solely DUV lithography). TSMC does not explicitly say how many layers use EUVL on N7+ or N6, but the company does confirm that the latter adds one additional EUVL layer when compared to the former.Via: AnandTech
TSMC says most 7nm clients will move to 6nm
Posted on Thursday, May 02 2019 @ 12:16 CEST by Thomas De Maesschalck