Samsung is now sampling DDR4 memory chips with a capacity of 32Gb (4GB), these enable the creation of memory modules with a higher density. These chips fall outside the DDR4 specification, which only describes 4Gb, 8Gb, and 16Gb memory chips. As such, memory makers like Samsung have to get more creative.
Samsung’s 32 Gb A-die DDR4-2666 chips are comprised of two stacked 16 Gb DDR4 dies produced using the company’s 10 nm-class process technology. Samsung offers two versions of 32 Gb DDR4 packages: one featuring a 2G x8 organization, another featuring a 1G x16 organization. The former is seen by memory controller as two memory devices, whereas the latter is considered as one DRAM device. The DDPs (dual die packages) come in standard 78 or 96-ball FBGA form-factor and use the industry-standard voltage of 1.2 V.