British tech site Hexus wrote a piece about JetCool Technologies, a cooling company that promises smaller, quieter, and more efficient cooling than anything else on the market. The MIT spinoff has been working five years on a new type of microjet cooling that promises to be 10x smaller than rivals and 10x better in terms of cooling performance.
What makes JetCool unique is that the cooling technology uses small jets of high velocity fluid to cool the device. The cooling fluid isn't passed over a surface like a heatsink or coldplate but aimed directly at the surface of the chip.
i>Thanks to this application of the microjet technology JetCool coolers "offer exceptional cooling performance for high power electronics at the chip or device-scale," says the firm. It has provided the diagram below, which charts the heat transfer coefficient between JetCool and rival cooling technologies. It is explained that thanks to the velocity of the sub-millimetre fluid jet, the jet passes through the thermal boundary layer at the surface, "producing very high heat transfer coefficients in the impingement zone".
The JetCool technology is aimed at datacenter CPUs, GPUs, ASICs, EV-based computers, and networking components.
More details can be read over here.