Chips built using 96-layer 3D NAND process will account for over 30% of the global NAND flash bit output in 2019. With suppliers stepping up their technology transitions with improvement in their process yield rates, 96-layer NAND flash output is expected to surpass the 64-layer chip output in 2020, the sources indicated.
The market for NAND flash memory has been oversupplied this year, the sources said. The chipmakers have been prompted to slow down their capacity expansion pace and even cut back on production to better control their inventory levels.
NAND makers speeding up transition to 96-layer
Posted on Tuesday, July 23 2019 @ 11:58 CEST by Thomas De MaesschalckDigiTimes heard NAND flash memory are stepping up the transition to 96-layer 3D NAND. Industry sources told the site that yields have improved and that 96-layer 3D NAND is likely to become mainstream in 2020. More layers means an increase in global NAND flash bit output as well as a reduction in costs.
