Samsung announced it has created world's first multi-chip package (MCP) that holds up to 10 memory semiconductors chips in one. The new 10-chip MCP uses two 4GB NAND flash memory chips, four 512MB DRAM memory chips and four 256MB NOR flash memory chips and has a total capacity of 11GB.
The multifunctional chip can mix and compound different memory chips, depending on its application. It is expected to contribute to space efficiency in mobile phones and other portable devices with its micro size.Read more at Korea Times.
The MCP package is gaining market attention as a core part in mobile phones with its high capacity and small size. Samsung Electronics developed the world's first six-chip MCP in 2003 and an eight-chip MCP earlier this year.