Posted on Friday, August 14 2020 @ 16:25 CEST by Thomas De Maesschalck
In a product briefing update, Micron reveals it's working on HBMnext. This new memory technology is expected to be available by the end of 2022. Micron also says its HBM2E will be available this year, the company will offer solutions with 3.2Gbps bandwith per pin and 410GB/s bandwidth per stack.
HBM2E is projected to enter the market in 2020. Micron plans to introduce HBM2E products in the second half of 2020. Our device will be fully JEDEC-complaint and available in 4H/8Gb and 8H/16GB densities, with data rates of 3.2Gb/s or potentially higher.
HBMnext is projected to enter the market toward the end of 2022. Micron is fully involved in the ongoing JEDEC standardization. As the market demands more data, HBM-like products will thrive and drive larger and larger volumes.
