DDI is a semiconductor located in the periphery of a display panel, driving the LCD cells by transmitting electric signals to individual pixels. As the push toward large, high-resolution displays accelerates, DDI has become a key component, as more than 20 DDIs are usually integrated per panel.
With the required number of ICs dramatically reduced, the LCD module's power consumption will decrease and its overall price competitiveness is expected to improve. In addition, with the development of this next-generation multi-channel DDI, Samsung is proposing a new standard for this segment of the LCD industry.
Samsung has reduced the pad pitch inside the IC to 25um. The company has also developed a new material-based advanced chip-on-film (COF) technology capable of printing film pattern pitch within 25um.
“We employed a wide range of next-generation DDI core technologies to develop this Source Driver IC”, said Sayoon Kang, principal engineer for Samsung's System LSI Interconnect Product and Technology Team . “With this new technology, we'll solidify our global leadership position in developing display driver ICs for the LCD market.”