Firms developing bendable processor

Posted on Monday, Dec 19 2005 @ 00:56 CET by Thomas De Maesschalck
The Inq reports TDK along with Japanese Semiconductor Energy Laboratory is developing a CPU which will bend.

Besides this interesting feature it will also feature wireless capabilities and built-in signal encryption.

The processor is first made on glass and then transferred to plastic and according to the article it can be powered by wireless signals.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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