Firms developing bendable processor

Posted on Monday, December 19 2005 @ 0:56 CET by Thomas De Maesschalck
The Inq reports TDK along with Japanese Semiconductor Energy Laboratory is developing a CPU which will bend.

Besides this interesting feature it will also feature wireless capabilities and built-in signal encryption.

The processor is first made on glass and then transferred to plastic and according to the article it can be powered by wireless signals.

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