The Inq reports TDK along with Japanese Semiconductor Energy Laboratory is developing a CPU which will bend.
Besides this interesting feature it will also feature wireless capabilities and built-in signal encryption.
The processor is first made on glass and then transferred to plastic and according to the article it can be powered by wireless signals.
Firms developing bendable processor
Posted on Monday, December 19 2005 @ 0:56 CET by Thomas De Maesschalck