"The move from 200- to 300-mm wafers was a revolutionary transformation, creating the first fully automated fabs,” said Scott Kramer, director of ISMI in an interview with EE Times. "It required a very high R&D investment to make that happen.More details at EE Times.
"The objective for the next generation is to make it more evolutionary,” Kramer added. “Three hundred millimeter was quite an abrupt change with many new standards. If we repeat that, we will have failed,” he added.
Chip makers preparing road to 450mm wafers
Posted on Friday, January 27 2006 @ 14:30 CET by Thomas De Maesschalck
Thirteen semiconductor makers will meet behind closed doors today to discuss the roadmap to 450mm wafers. This includes AMD, HP, IBM, Infineon, Matsushita, Philips, TSMC and Texas Instruments.