Chip makers preparing road to 450mm wafers

Posted on Friday, January 27 2006 @ 14:30 CET by Thomas De Maesschalck

Thirteen semiconductor makers will meet behind closed doors today to discuss the roadmap to 450mm wafers. This includes AMD, HP, IBM, Infineon, Matsushita, Philips, TSMC and Texas Instruments.

"The move from 200- to 300-mm wafers was a revolutionary transformation, creating the first fully automated fabs,” said Scott Kramer, director of ISMI in an interview with EE Times. "It required a very high R&D investment to make that happen.

"The objective for the next generation is to make it more evolutionary,” Kramer added. “Three hundred millimeter was quite an abrupt change with many new standards. If we repeat that, we will have failed,” he added.

More details at EE Times.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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