Posted on Saturday, Jan 28 2006 @ 00:52 CET by Thomas De Maesschalck
Intel's new 65nm dual-core Presler and Yonah chips got no balls - and no, I'm not kidding. For these new processors Intel decided to start using Copper Pillar Bumping (CPB) technology instead of tiny solder balls made of a lead-tin alloy to connect the die to the chip package's pins.
The chip giant is the first chip maker to utilize this technique. The reason why they started using it is to cut the amount of lead uses in the products, to help meet the Reduction of Hazardous Substances (RoHS) legislation in Europe and elsewhere.
A picture can be found at Register Hardware