Intel 65nm CPUs use Copper Pillar Bumping

Posted on Saturday, January 28 2006 @ 0:52 CET by Thomas De Maesschalck

Intel's new 65nm dual-core Presler and Yonah chips got no balls - and no, I'm not kidding. For these new processors Intel decided to start using Copper Pillar Bumping (CPB) technology instead of tiny solder balls made of a lead-tin alloy to connect the die to the chip package's pins.

The chip giant is the first chip maker to utilize this technique. The reason why they started using it is to cut the amount of lead uses in the products, to help meet the Reduction of Hazardous Substances (RoHS) legislation in Europe and elsewhere.

A picture can be found at Register Hardware.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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